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| Emerson Network Power Announces High Density LGA C Series Power Conversion Modules |
Low profile power converters offer users a scalable and cost-effective surface-mount power solution
CARLSBAD, CA — April 28, 2009 - Emerson Network Power, a business of Emerson and
the global leader in enabling Business-Critical Continuity™, today announced its latest line of
high density, non-isolated board-mount power converters for space sensitive applications. LGA
C Series power converters offer users a cost-effective, surface-mount power solution capable
of delivering 15-100W of scalable power via a low profile land grid array package.
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The converters’ ultra-compact Land Grid Array (LGA) packaging enables a uniform, low profile
(3.2mm typical) form factor, making them ideal for power applications where board space,
airflow and height dimensions are critical. The power converters can be mounted on either side
of many circuit boards for flexible space management and are fully-compatible with automated
circuit board assembly processes. The packaging’s design also offers designers an opportunity
to employ a variety of conductive cooling techniques (heatsinks, coldplates, etc) via either
surface.
LGA C Series power converters are certified RoHS compliant, offer high efficiency (92 percent
typical at full load) under standard operating conditions and accommodate a wide range (-40 to
+85 ºC) of ambient operating temperatures. The power converters are also fully equipped with a
variety of best-in-class features – including under-voltage lockout, differential remote sense,
output margining and short-circuit protection – to ensure high power reliability at a competitive
price point.
LGA C Series power conversion modules are currently available, with a standard lead time of
stock to eight weeks, and are priced starting at $5.40US per unit in OEM quantities. For
additional information, visit www.PowerConversion.com/LGA.
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