MEMORY SOLUTIONS

Flash For All Reasons

The wide variety of Intel® Flash memory hardware solutions are designed to meet the diverse needs of embedded system designs. Four series of devices cover the entire range of requirements in terms of density, speed of operation, security, supply voltage, organisation and packaging.



The StrataFlashÆ® Embedded Memory (P30) is the company's lowest cost-per-bit NOR embedded solution, manufactured using 130nm process lithography. The devices are available in densities from 64Mbit to 512Mbit and a variety of packaging including TSOP, BGA and QUAD+ and in both 1.8 V and 3 V to suit a wide range of embedded applications.

This series of devices include block-locking and OTP facilities with a 128-bit security register, allowing their use in revenue-sensitive applications such as customer equipment for subscription-based services. With 16-bit-wide organisation, the memories support burst and page modes, and factory programming. Overall they suit embedded applications where storage of code and data is combined.

The Intel® Advanced Boot Block+ (C3) Flash Memory family is the company's fifth generation of successful boot block memory products. They are the industry's most popular low-density Flash solution, with the smallest single-bit die size.


32-Mbit Die Comparison: 0.13 µm vs. 0.18 µm

The Intel® Embedded Flash Memory (J3 v. D) family offers cost-effective, high-density Flash memory solutions for 3V legacy designs. With both 4- and 8-word page mode, J3 v. D offers fast code execution combined with low-cost data storage. It provides enhanced security with selectable One-Time Programming (OTP), enabling customers to permanently lock down any block in the Flash memory array, to protect code or data for the life of the device.



The company's fourth range is its Intel® Wireless Flash Memory (W18/W30) family, its highest-performance solution for hand-held, battery-backed embedded applications that run at clock speeds of up to 66MHz and need flexible partition Read-While-Write operation.

Features

• Comprehensive range of Flash memory products
• Series optimised for embedded, boot-block, wireless and legacy 3V applications
• Densities from 8Mbit to 512Mbit
• x8 or x16 organisations
• TSOP, QUAD+, BGA and VF BGA packages
• 1.8V or 3.0V supplies
• 1.8V or 3.0V I/Os
• Burst mode and page mode options
• Read While Write (RWW) and Read While Erase (RWE) options
• Multiple security modes
  • Block locking
  • Block OTP
  • 128-bit security register

Applications

• Consumer electronics
• Wired and wireless communications
• Industrial applications

For further information, including Intel® Flash Memory Application Note, the Intel StrataFlash® Product Brief and Presentation, please click here.